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1 standard products ut63m143 mil-std-1553a/b bus +3.3v transceiver datasheet march 18, 2011 www.aeroflex.com/hirel features ? 3.3-volt only operation ? dual-cavity monolithic silicon technology ? fit and functionally compatible to industry standard transceiver ? idle low transmitter inputs and receiver outputs ? operating temperature range: -55 ? c to +125 ? c ? operational environment: - total-dose tolerance: 300 krads and 1mrad(si) - sel immune to a let of 111 mev-cm 2 /mg ? packaging options: - 24-lead flatpack, dual-channel 50-mil center - 36-pin dip, dual-channel 100-mil center ? standard microcircuit drawing (smd): 5962-07242 - qml q and qml v compliant part introduction the monolithic ut63m143 tr ansceivers are complete transmitter and receiver pairs for +3-volt mil-std-1553a and 1553b applications. encoder a nd decoder interfaces are idle low. the receiver section of the ut 63m143 series accepts biphase- modulated manchester ii bipolar data from a mil-std-1553 data bus and produces ttl-level signal data at its rxout and rxout outputs. an external rxen input enables the receiver outputs or disables them low. the transmitter sectio n accepts biphase ttl-level signal data at its txin and txin and produces mil-std-1553 data signals. the transmitter?s output voltage is typically 7.1 v pp,ll . activating the txihb input or setting both data inputs to the same logic level disables the transmitter outputs. the ut63m143 series offers co mplete transmitter and receiver pairs packaged in a dual-channel 36-pin dip or 24-lead flatpack configurations designed for use in any mil-std-1553 application. txin rxout rxen to decoder compare filter limiter and filter txihb figure 1. functional block diagram rxin txout rxin txout rxout txin threshold reference from encoder drivers
2 legend for type field: ti = ttl input to = ttl output do = differential output di = differential input dio = differential input/output ( ) = channel designator [ ] = 24-lead flatpack transmitter note: 1. the 24-lead flatpack inte rnally connects txout to rxin (cha, chb) and txout to rxin (cha , chb ) for each channel. name pin number type description txout 1 (a) txout (b) 1 [1] 10 [7] do [dio] do [dio] transmitter outputs: txout and txout are differential data signals. txout 1 (a) txout (b) 2 [2] 11 [8] do [dio] do [dio] txout is the half-cycle complement of txout. txihb (a) txihb (b) 34 [22] 25 [16] ti ti transmitter inhibit: this is an active high input signal. high input disables transmitter outputs. txin (a) txin (b) 35 [23] 26 [17] ti ti transmitter input: txin and txin are complementary ttl- level manchester ii encoder inputs. txin (a) txin (b) 36 [24] 27 [18] ti ti txin is the complement of txin input.
3 receiver note: 1. the 24-lead flatpack internally connects txout to rxin (cha, chb) and txout to rxin (cha , chb ) for each channel. power and ground (note 1) note: 1. recommended decoupling it to place one 1 ? f tantalum and one 0.1 ? f ceramic, capacitor as close as possible to each v dd power pin. name pin number type description rxout (a) rxout (b) 5 [4] 14 [10] to to receiver outputs: rxout and rxout are complementary manchester ii decoder outputs. rxout (a) rxout (b) 8 [6] 17 [12] to to rxout is the complement of rxout output. rxen (a) rxen (b) 6 [5] 15 [11] ti ti receiver enable/disable: this is an active high input signal. low input forces rxout and rxout low. rxin 1 (a) rxin (b) 29 [1] 20 [7] di [dio] di [dio] receiver input: rxin and rxin are biphase-modulated manchester ii bipolar inputs from mil-std-1553 data bus. rxin 1 (a) rxin (b) 30 [2] 21 [8] di [dio] di [dio] rxin is the half-cycle complement of rxin input. name pin number type description v dd (a) v dd (b) 33 [20] 24 [14] pwr pwr +3.3 v dc power ( ? 0.15v) recommended decoupling capacitors: 1 ? f (tantalum) and 0.1 ? f (ceramic) gnd (a) gnd (b) 3, 7, 31 [3,19,21] 12, 16, 22 [9,13,15] gnd gnd ground reference
4 36 26 10 11 13 14 15 17 18 16 27 28 35 34 33 32 31 30 29 25 24 23 22 21 20 19 1 2 3 4 5 6 7 8 9 12 txout rxout txout gnd nc rxout rxen gnd nc txout rxout txout gnd nc rxout rxen gnd nc txin rxin v dd txin txihb nc gnd rxin nc txin rxin v dd txin txihb nc gnd rxin nc channel a channel b figure 2a. functional pin diagram -- dual channel (36) 24 17 7 8 10 11 12 18 23 22 21 20 19 16 15 14 13 1 2 3 4 5 6 9 cha cha gnd rxout rxen chb chb gnd rxout rxen txin v dd txin txihb gnd txin v dd txin txihb gnd channel a channel b figure 2b. functional pin diagram -- dual channel (24) 1 rxout rxout gnd gnd note: 1. the 24-lead flatpack internally connect s txout to rxin (cha, chb) and txout to rxin (cha , chb ) for each channel.
5 transmitter the transmitter section accepts t tl-level, biphase manchester ii encoded data and converts this data into differential phase- modulated current drive. the tr ansmitter curren t drivers are coupled to a mil-std-1553 data bus via a transformer driven from the txout and txout terminals. the transmitter output terminals? non-transmitting state is enabled by asserting txihb (logic ?1?), or by placing both txin and txin at the same logic level. reference table 1, transmit operating mode, for a list of the functions for the output data in reference to the state of txihb. figure 3 shows typical transmitter waveforms. receiver the receiver section accepts biphase differential data from a mil-std-1553 data bus at its rxin and rxin inputs. the receiver converts input data to ttl-level, biphase manchester ii format and is available for decoding at the rxout and rxout terminals. the outputs rxout and rxout represent positive and negative excursions (respectively) of the inputs rxin and rxin . figure 4 shows typical receiver output waveforms. table 1. transmit operating mode notes: 1. x = don?t care. 2. transmitter output terminals are in the non-transmitting mode during off-time. 3. transmitter output terminals are in the non-transmitting mode during off-time, independent of txihb status. txin txin txihb txout x 1 x 1 off 2 0 0 x off 3 0 1 0 on 1 0 0 on 1 1 x off 3 90% 10% txout , txout txin txin line-to-line differential output txin txihb txin t txdd both high or both low figure 3. typical transmitter wave rxout rxout rxout rxout line-to-line differential input t rxdd figure 4. typical receiver waveforms
6 data bus interface 1 the designer can connect the ut63 m143 to the data bus via a short-stub (direct-c oupling) connection or a long-stub (transformer - coupling) connection. use a short-stub connection when the distan ce from the isolation transformer to the data bus does not exc eed a one-foot maximum. use a long-stub conn ection when the distance from the isolati on transformer exceeds th e one-foot maximum and is less than twenty feet. figure 5 shows various examples of bus coupling configurations. th e ut63m143 series transceivers are designed to function with mil-std-1553a and 1553b compatible transformers. note: 1. the 24-lead flatpack internally connects txout to rxin and txout to rxin for each channel. 55 ohms 55 ohms note: z o defined per mil-std-1553b, section 4.5.1.5.2.1. z o z o +3.3v dc operation (1 : 3.0) short-stub (direct coupled) figure 5. bus coup ling configuration 20 ft max (1 : 1.4) (1 : 2.15) long-stub (transformer coupled) .75 z o .75 z o txout rxin rxin txout direct-coupled isolation transformer e.g. beta p/n: mlp-2016 1 ft max. transformer-coupled isolation transformer e.g. beta p/n: mlp-2216 coupling transformer
7 rl = 15 pf 15 pf 55 ohms 55 ohms 35 ohms a receiver transmitter tp tp * rxin rxen rxout figure 6. direct couple d transceiver with load 55 ohms 55 ohms 35 ohms txout txin rxin rxout txin txihb txout 2kohms 2kohms (3.0 : 1) (1 : 3.0) notes: 1. tp = test point. 2. rl removed for terminal input impedance test. 3. txout and rxin tied together. txout and rxin tied together. v in v dd (1 : 1.4) 15 pf 15 pf receiver tp tp transmitter 35 ohms a b rxen (2.15 : 1) (1.4 : 1) rxout v * cc (1 : 2.15) rxin rxin txin txin txihb txout txout rxout 2kohms 2kohms notes: 1. tp = test point. 2. rl removed for terminal impedance test. 3. txout and rxin tied together. txout and rxin tied together. figure 7. transformer coup led transceiver with load .75 z o .75 z o v in
8 recommended thermal protection all packages should mount to or contact a heat removal rail located in the printed ci rcuit board. to insure proper heat transfe r between the package and the heat removal rail, use a thermally-conductive material between the package and the heat removal rail. some recommends using a material like ai technology me7158, me7159, or eccobond 45 with eccobond 15lv catalyst to insure heat transfer between the packag e and heat removal rail. table 2. transformer requirements coupling technique ?? 3.3v dc direct-coupled: isolation transformer ratio 3.0 : 1 transformer-coupled: isolation transformer ratio 2.15 : 1 coupling transformer ratio 1 : 1.4 a terminal notes: 1. transformer coupled stub: terminal is defined as transceiver plus isolatio n transformer. point a is defined in figure 7. 2. direct coupled stub: terminal is defined as transceiver plus isolation transformer and fault resist ors. point a is defined in figure 6. rl txout txout figure 8. transceiver test circuit mil-std-1553
9 absolute maximum ratings 1 notes: 1. stress outside the listed absolute maximu m rating may cause permanent damage to the devices. this is a stress rating only, an d functional operation of the device at these or any other conditions beyond limits indicated in the operational sections of th is specification is not recommen ded. exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2. p dmax =(t jmax - t cmax ) / ? jc , per mil-std-883 m1012 section 3.4.1 recommended operating conditions parameter limits unit v dd -0.3 to +7.0 v input voltage range (receiver) 8 v pp logic input voltage range -0.3 to v dd +0.3 v maximum package power dissipation @ tc=+125 o c 2 7.1 w thermal impedance junction to case 2 7.0 ? c/w maximum junction temperature +175 ? c storage temperature -65 to +150 ? c receiver common mode input voltage range -5 to +5 v parameter limits unit supply voltage range +3.15 to +3.45 v logic input voltage range 0 to v dd v receiver differential voltage @ rxin & rxin 0.4 to 3.0 v p-p, l-l receiver common mode voltage range + 4.0 v driver peak output current 960 ma serial data rate 0.3 to 1 mhz case operating temperature range (t c ) -55 to +125 ? c driver typical output current 600 ma
10 dc electrical characteristics 1 (v dd = 3.3v ? 0.15v; -55 ? c < t c < +125 ? c) note: 1. all tests guaranteed per test figure 6. 2. rxen has ~1.2 ? a pull up. 3. guaranteed by design but not tested. symbol parameter minimu m maximum unit condition v il input low voltage 0.8 v rxen, txihb, txin, txin v ih input high voltage 2.0 v rxen, txihb, txin, txin i i input current -10 10 ? a v in = v dd or v ss , rxen 2 , txihb, txin, txin v ol output low voltage 0.55 v i ol = 4ma; rxout, rxout v oh output high voltage 2.4 v i oh = -0.4ma; rxout, rxout i dd v dd supply current 14.5 200 387 670 761 ma ma ma ma ma 0% duty cycle (non-transmitting) 25% duty cycle ( ? = 1mhz) 50% duty cycle ( ? = 1mhz) 87.5% duty cycle ( ? = 1mhz) 100% duty cycle ( ? = 1mhz) 3
11 receiver electrical characteristics 1 (v dd = 3.3v ? 0.15v; -55 ? c < t c < +125 ? c) notes: 1. all tests guaranteed per test figure 6. 2. guaranteed by device characterization. ca pacitance is measured only for initial qua lification and after an y process or design changes which may affect input or output capacitance. 3. pass/fail criteria per the test method described in mil-hdbk-15 53 appendix a, rt validation test plan, section 5.1.2.2, commo n mode rejection. 4. guaranteed by design, but not tested. 5. upper limit guaranteed by design, but not tested. 6. tested functionally. symbol parameter minimu m maximum unit condition c in 2 input capacitance 15 pf rxen; input ?? = 1mhz @ 0v c out 2 output capacitance 20 pf rxout, rxout ; ?? = 1mhz @ 0v v ic 4 common mode input voltage -5 5 v direct-coupled stub; input 1.2 v pp , 200ns rise/fall time ? 25ns, ?? = 1mhz v th input threshold voltage 4 (no response) input threshold voltage (no response) 6 input threshold voltage 4 (response) input threshold voltage (response) 6 0.86 1.20 0.20 0.28 14.0 20.0 5 v pp,l-l v pp,l-l v pp,l-l v pp,l-l transformer-coupled stub; input at ?? = 1mhz, rise/fall time 200ns at (receiver output 0 ? 1 transition) direct-coupled stub; input at ?? = 1mhz, rise/fall time 200ns at (receiver output 0 ? 1 transition) transformer-coupled stub; input at ?? = 1mhz, rise/fall time 200ns at (receiver output 0 ? 1 transition) direct-coupled stub; input at ?? = 1mhz, rise/fall time 200ns at (receiver output 0 ? 1 transition) cmrr 3, 4 common mode rejection ratio pass/fail n/a
12 transmitter electrical characteristics 1 (v dd = 3.3v ? 0.15v; -55 ? c < t c < +125 ? c) symbol parameter minimum maximum unit condition v o output voltage swing per mil-std-1553b 3, 5 (see figure 9) per mil-std-1553b (see figure 9) per mil-std-1553a 5 (see figure 9) 18 6.0 6.0 27 9.0 20 v pp,l-l v pp,l-l v pp,l-l transformer-coupled stub, figure 8, point a; input ?? = 1mhz, r l = 70 ohms direct-coupled stub, figure 8, point a; input ?? = 1mhz, r l = 35 ohms figure 7, point a; input ?? = 1mhz, r l = 35 ohms v ns output noise voltage differential 5 (see figure 9) output noise voltage differential 2 (see figure 9) 14 5 mv-rms l-l mv-rms l-l transformer-coupled stub, figure 8, point a; input ?? = dc to 10mhz, r l = 70 ohms direct-coupled stub, figure 8, point a; input ?? = dc to 10mhz, r l = 35 ohms v os output symmetry 5 output symmetry 4 -250 -90 +250 +90 mv pp,l-l mv pp,l-l transformer-coupled stub, figure 8, point a; r l = 140 ohms, measurement taken 2.5 ? s after end of transmission direct-coupled stub, figure 8, point a; r l = 35 ohms, measurement taken 2.5 ? s after end of transmission v dis output voltage distortion 5 (overshoot or ring) (see figure 9) output voltage distortion (overshoot or ring) (see figure 9) -900 -300 +900 +300 mv peak,l-l mv peak,l-l transformer-coupled stub, figure 8, point a; r l = 70 ohms direct-coupled stub, figure 8, point a; r l = 35 ohms c in 6 input capacitance 15 pf txihb, txin, txin ; input ?? = 1mhz @ 0v t iz 5 terminal input impedance 1 2 kohm kohm transformer-coupled stub, figure 7, point a; input ?? = 75khz to 1mhz (power on or power off; non- transmitting, r l removed from circuit). direct-coupled stub, figure 6, point a; input ?? = 75khz to 1mhz (power on or power off; non-transmitting, r l removed from circuit).
13 notes: 1. all tests guaranteed per test figure 6. 2. guaranteed by device characterization. 3. for mil-std-1760, 20v pp,l-l min. tested in direct-coupled mode to limits of 6.67v to 9.0v pp,l-l . 4. test in accordance with the method described in mil-std-1553b output symmetry, section 4.5.2.1.1.4. 5. guaranteed by design, but not tested. 6. guaranteed by device characterization. capacitance is measured only for initial qualifica tion and after any process or desig n changes which may affect input or output capacitance.
14 ac electrical characteristics 1 (v dd = 3.3v ? 0.15v; -55 ? c < t c < +125 ? c) notes : 1. all tests guaranteed per test figure 6. 2. supplied as a design limit but not guaranteed or tested. 3. delay time from transmit inhibit (1.5 v) rising to tr ansmit off (280mv). 4. delay time from not transmit inhibit (1.5v) falling to transmit on (1.2v). symbol parameter minimum maximum unit condition t r, t f transmitter output rise/ fall time (see figure 10) 100 300 ns input ?? = 1mhz 50% duty cycle: direct-coupled r l = 35 ohms output at 10% through 90% points txout, txout . figure 10. t rxdd rxout delay -200 200 ns rxout to rxout , figure 4. t txdd 2 txin skew -25 25 ns txin to txin , figure 3. t rzcd zero crossing distortion (see figure 11) -150 150 ns direct-coupled stub; input ?? = 1mhz, 3 v pp (skew input ? 150ns), rise/fall time 200ns. t tzcs zero crossing stability (see figure 11) -25 25 ns input txin and txin should create transmitter output zero crossings at 500ns, 1000ns, 1500ns, and 2000ns. these zero crossings should not deviate more than ? 25ns. t dxoff 3 transmitter off; delay from inhibit active 100 ns txin and txin toggling @ 1mhz; txihb transitions from logic zero to one, see figure 12. t dxon 4 transmitter on; delay from inhibit inactive 150 ns txin and txin toggling @ 1mhz; txihb transitions from logic one to zero, see figure 12. t rcvoff receiver off 50 ns receiver turn off time, see figure 13. t rcvon receiver on 50 ns receiver turn on time, see figure 13. t rcvpd receiver propagation 450 ns receiver propagation delay, see figure 13. t xmitpd transmitter propagation 200 ns transmitter propagation delay, see figure 12.
15 figure 9. transmitter ou tput characteristics (v dis , v ns , v o ) figure 10. transmitter output zero cros sing stability, rise time, fall time (t tzcs , t r , t f ) figure 11. receiver input ze ro crossing distortion (t rzcd ) 0 volts 0 volts v dis (ring) v dis (overshoot) v o v ns 90% 10% 10% 90% v o t r t f t tzcs t rzcd v in
16 10% 50% 50% 50% zero crossing t dxon t xmitpd t dxoff tx output inhibit txin and txin figure 12. transmitter timing 50% 50% 50% 50% 50% t rcvpd t rcvon t rcvoff zero crossing rx input rxen rx out and rx out rxen figure 13. receiver timing 10%
17 figure 14. 36-pin side-brazed dip, dual cavity notes: 1. package material: opaque ceramic. 2. all package finishes are per mil-prf-38535. 3. it is recommended that package cer amic be mounted on a heat removal rail in the printed circuit board . a thermally conductive material should be used. lead 1 indicator 0.005 min. .610 max. .570 min. .015 max. .008 min. .620 max. .590 min. (at seating plane) 1.89 max. 0.001 min. .023 max. .014 min. 0.155 max. 0.150 min. 0.100
18 figure 15. 24-lead flatpack, top brazed, dual cavity (50-mil lead spacing) notes: 1. package material: opaque ceramic. 2. all package plating finishes are per mil-prf-38535. 3. it is recommende d that package ceramic be mounted to a heat removal rail located in the printed circuit boar d. a thermally conductive ma terial should be used. .810 max. .600 max. .400 min. lead 1 indicator 0.095 max. 0.070 ? 0.007 (at ceramic body) .050 0.016 ? .002 .007 + .002 - .001
19 ordering information ut63m143 monolithic trans ceiver, 3v operation: smd lead finish (notes: 1 and 2): (a) = solder (c) = gold (x) = optional case outline: (x) = 36 pin dip (y) = 24 pin fp class designator (note: 3): (q) = class q (v) = class v device type (01) = mil-std-1553 (02) = mil-std-1760 drawing number: 07242 total dose: (h) = 1e6 rads(si) (g) = 5e5 ads(si) (f) = 3e5 rads(si) (r) = 1e5rads(si) (-) = none federal stock class designator: no options notes: 1. lead finish (a, c, or x) must be specified. 2. if an "x" is specified when ordering, part marking will matc h the lead finish and will be e ither "a" (solder) or "c" (gold) . 3. total dose must be specified for all qml v devices. 5962 * 07242 * * * *
20 ut63m143 monolithic tran sceiver, 3v operation lead finish: (notes: 1 and 2) (a) = solder (c) = gold (x) = optional screening: (notes: 3 and 4) (c) = hirel temperature (p) = prototype package type: (b) = 36-pin dip (c) = 24-pin fp standard: (-) = mil-std-1553 compliant (e) = mil-std-1760 compatible ut63m143 * * * * notes: 1. lead finish (a, c, or x) must be specified. 2. if an "x" is specified when ordering, part marking will match the lead finish and will be either "a" (solder) or "c" (gold) . 3. hirel temperature range devices are burned-in and tested at -55 ? c, room temperature, and 125 ? c. radiation characteristics are neither tested nor guaranteed and may not be specified. 4. prototype devices are tested at 25 ? c only. radiation characteristics are ne ither tested nor guaranteed and may not be specified. lead finish is gold only.
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